Nextwaves Ụlọ ọrụ Inlay Chip Bonding
Ụlọ ọrụ mmepụta ihe dị elu na-ebuga inlays RFID dị elu na nnukwu ọnụọgụ.
100M+
Ikike Mmepụta Kwa Afọ
Usoro njikọ dị elu nwere ike imezu nnukwu iwu zuru ụwa ọnụ nwere obere oge ndu.
±10µm
Bonding izi ezi
Teknụzụ flip-chip dị elu na-ahụ maka njikọ antenna-to-chip zuru oke maka arụmọrụ RF kachasị.
99.9%
Usoro Ọnụego
Nyocha anya akpaka (AOI) na nnwale RF na usoro ọ bụla na-ekwe nkwa nnyefe na-enweghị ntụpọ.
Ụlọ ọrụ Gallery
Nleba anya n'ime usoro na akụrụngwa mmepụta anyị dị elu.
