100M+
Annual Production Capacity
High-speed bonding lines capable of fulfilling massive global orders with short lead times.
Manufacturing
Nextwaves Inlay Chip Bonding Facility
State-of-the-art manufacturing facility delivering high-performance RFID inlays at scale.
Annual Production Capacity
High-speed bonding lines capable of fulfilling massive global orders with short lead times.
100M+
±10µm
Bonding Accuracy
Advanced flip-chip technology ensuring stable antenna-to-chip connectivity for high RF performance.
99.9%
Yield Rate
Automated optical inspection (AOI) and RF testing at every stage before delivery.
Facility Gallery
A glimpse into our advanced manufacturing process and equipment.
See the facility behind your tags
Tell us about your volumes and timelines. We will show you how our bonding lines deliver at scale.