Nextwaves Inlay Chip Bonding Facility
State-of-the-art manufacturing facility delivering high-performance RFID inlays at scale.
100M+
Annual Production Capacity
High-speed bonding lines capable of fulfilling massive global orders with short lead times.
±10µm
Bonding Accuracy
Advanced flip-chip technology ensuring perfect antenna-to-chip connectivity for maximum RF performance.
99.9%
Yield Rate
Automated optical inspection (AOI) and RF testing at every stage guarantee defect-free delivery.
Facility Gallery
A glimpse into our advanced manufacturing process and equipment.
