100M+
Annual Production Capacity
High-speed bonding lines capable of fulfilling massive global orders with short lead times.
Manufacturing
Nextwaves Inlay Chip Bonding Facility
State-of-the-art manufacturing facility delivering high-performance RFID inlays at scale.
Talk to our teamAnnual Production Capacity
High-speed bonding lines capable of fulfilling massive global orders with short lead times.
100M+
±10µm
Bonding Accuracy
Advanced flip-chip technology ensuring stable antenna-to-chip connectivity for high RF performance.
99.9%
Yield Rate
Automated optical inspection (AOI) and RF testing at every stage before delivery.
From design to inlay reel
From the engineering bench to the bonding line, all in Ho Chi Minh City.
- 01
Hardware design
Our engineers draw the schematics in KiCad, pick the parts and test every prototype board at the bench before it goes to production.
4 photos
- 02
Die pick-up
The diced wafer holds thousands of RFID dies. A vacuum nozzle picks them one at a time under a locating light, ready for bonding.
5 photos
- 03
Flip-chip bonding
The bond head flips each die and sets it on the antenna's contact pads to within ±10µm.
2 photos
- 04
Thermocompression curing
A row of thermode heads runs along the antenna web, curing the adhesive so every chip stays bonded with a stable contact.
2 photos
- 05
Inspection and rewind
Every inlay goes through optical and RF checks before the web is rewound into finished reels for delivery.
2 photos
See the facility behind your tags
Tell us about your volumes and timelines. We will show you how our bonding lines deliver at scale.